Uniform smart soldering increases the power and efficiency of the module, and improves the power load capacity. M10 wafer and 54 cell design, fully considering the size and weight of modules in distributed applications.
Smart module packaging solutions are used to achieve high reliability, low-cost transportation and logistics. The working current is about 13A, which is perfectly adapted to mainstream string inverters.
Main Features
Based on M10 Wafer, best choice for ultra-large power plants
Advanced module technology delivers superior module efficiency
